发明名称 |
METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
A method for forming a laminated structure in which four or more chips are laminated together includes at least a step of laminating a first chip sub-block comprised of a plurality of laminated chips together with a second chip sub-block comprised of a plurality of laminated chips.
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申请公布号 |
US2006207086(A1) |
申请公布日期 |
2006.09.21 |
申请号 |
US20060276766 |
申请日期 |
2006.03.14 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SAEKI YOSHIHIRO |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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