Thermal interface structure and process for making the same

摘要

A thermal interface structure ( 10, 20 ) is provided for a highly conductive thermal interface between an electronic component and a cooling device for dissipating heat generated by the electronic component. The thermal interface structure includes a matrix ( 12, 22 ) and a plurality of carbon nanotubes ( 14, 24 ) incorporated in the matrix. The matrix is generally made from a phase change material. A method for making a thermal interface structure is also provided.