| 摘要 |
Conductive connections between components of an integrated circuit package are made, wherein carbon nanotubes (130, 430) extend from a surface of a first integrated circuit package component (120, 410) and distal ends of the carbon nanotubes are embedded in a connector (422) at a second integrated circuit package component (110, 420). The embedding approach involves, e.g., physical coupling (i.e., pressing) of the carbon nanotubes and the connector together. This approach is applicable to coupling a variety of components together, such as integrated circuit dies (flip chip (120) and conventional (420) to package substrates (110, 410) and/or leadframes (410). |
