METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH BUILT-IN MULTILAYER CAPACITOR

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board with a built-in printed multilayer capacitor which increases an electrostatic capacity, so that a built-in capacitor may have plural conductive layers and plural dielectric layers.

SOLUTION: This invention comprises a first step of forming an insulating layer on a base substrate constituting a core layer, and laminating on the insulating layer an RCC in which a lower electrode layer is formed on the whole surface; a second step of forming an internal electrode layer after removing an upper part copper foil of the RCC; a third step of forming multilayers consisting of the dielectric layers and the internal electrode layer, by repeating several times an RCC lamination of the first step to the second step; and a fourth step of forming plural via-holes on the printed circuit board on which plural dielectric layers and plural internal electrode layers are formed, and depositing an inner wall of the via-hole and conducting between the internal electrode layers to complete the multilayer capacitor.

COPYRIGHT: (C)2006,JPO&NCIPI