| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit substrate which can stabilize the bonding strength of a packaging element, and to provide a method of manufacturing the circuit substrate and an electronic circuit apparatus. <P>SOLUTION: The circuit substrate 100 includes a ceramic substrate 10, thermoplastic resin films 20a and 20b, a circuit element 30, etc. A conductor pattern 11 is formed on the ceramic substrate 10. Thermoplastic resin films 20a and 20b have a pierced hole 23 which is closed by a conductor pattern 21 (first conductor pattern in this invention) in one opening and makes a bottomed via-hole. In the circuit element 30, an electrode 31 is inserted in the pierced hole 23, and carried on the thermoplastic resin film 20b so that the electrode 31 is inserted in the pierced hole 23 and the electrode 31 and the conductor pattern 21 may be joined. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
