| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an inexpensive cavity structured printed wiring board in which a connection terminal (hereinafter referred to as "external electrode") between a cavity structure and an external circuit on either or both surfaces of a printed wiring board, and also to provide a mounting structure. <P>SOLUTION: A hollowing work portion 5 is formed on the center of a printed wiring board 6 having external terminals 1, through holes 2 having lid plating, bump connection lands 3 and solder resists 4. Subsequently, a printed wiring board 10 having component mounting lands 7, bump connection lands 8 and solder resists 9 is prepared, and paste solder 11' is printed on each of the lands 3. Finally, the lands 3, 7 are superimposed so that they oppositely contact the paste solders 11' and are subjected to reflow heating to electrically connect the printed wiring boards 6, 10 via the bumps 11, and thus, the manufacturing of the cavity structure wiring board is completed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
