| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor element package in which characteristic impedance of a lead is reduced and control range of the characteristic impedance of the lead can be expanded. SOLUTION: The optical semiconductor package has a disk-like stem 1, rod-like metal leads 3 and 13 protruding from a principal surface while penetrating the stem 1 in a thickness direction, and a mount 5 so provided as to vertically extend from the principal surface of the stem 1. The flat surface 51 of the mount 5 is so arranged as to face the leads 3 and 13. A dielectric substrate 6 is mounted on the flat surface 51, and an optical semiconductor chip 9 is mounted thereon. Two impedance-adjusting dielectric substrates 7 are extended in parallel to the leads 3 and 13, have a rectangular shape in a plane view, and are so arranged as to cover the top of the flat surface 51 facing the leads 3 and 13. COPYRIGHT: (C)2006,JPO&NCIPI
|
