| 摘要 |
PROBLEM TO BE SOLVED: To obtain a lead frame for use in a semiconductor package equipped with a semiconductor chip in which heat generated from the semiconductor chip can be radiated efficiently to a circuit board and electrical connection can be sustained between the circuit board and the semiconductor chip. SOLUTION: The lead frame 1 comprises a planar stage portion 5 for arranging a semiconductor chip 3 on the surface 5a, a frame portion 7 having a plurality of leads 17, 19 being arranged on the periphery thereof, and a portion 9 for coupling the frame portion 7 and the stage portion 5 wherein a recess 21 being filled with resin is formed in the rear surface 5b of the stage portion 5. COPYRIGHT: (C)2006,JPO&NCIPI
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