发明名称 |
Methods of producing a package for semiconductor chips |
摘要 |
The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.
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申请公布号 |
US2006211166(A1) |
申请公布日期 |
2006.09.21 |
申请号 |
US20040483212 |
申请日期 |
2004.10.05 |
申请人 |
BISCHOF ANDREAS;KAHLISCH KNUT;MIETH HENNING |
发明人 |
BISCHOF ANDREAS;KAHLISCH KNUT;MIETH HENNING |
分类号 |
H01L21/00;H01L21/58;H01L23/16;H01L23/31 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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