Thermoelectric module and solder therefor

摘要

A thermoelectric module comprises a plurality of thermoelectric elements which are arranged between a pair of substrates having electrode patterns and which are bonded with the electrode patterns via solder in which at least one dispersion phase is dispersed into a matrix phase, wherein the melting temperature of the dispersion phase is higher than that of the matrix phase (i.e., 240° C. or over), and the dispersion phase comprises fine particles whose average diameter is 5 mum or less. The solder is constituted by an alloy so as to realize a volume ratio of 40% or less, wherein it is composed of a Bi-Cu-X alloy or a Bi-Zn-X alloy (where 'X' represents at least one element selected in advance). Preferably, the solder is constituted by powder containing fine particles whose average diameter is 100 mum or less or thin plates whose average thickness is 500 mum or less.