FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

摘要

A flip chip mounting method and a bump forming method which can be applied to next generation LSI flip chip mounting and have high productivity and reliability. In a state where a semiconductor chip (20) having a plurality of electrode terminals (12) is held to face a circuit board (21) having a plurality of connecting terminals (11) with a fixed space in between, the semiconductor chip (20) and the circuit board (21) are dipped for a prescribed time in dip bath (40) containing a molten resin (14) including a molten solder powder. In such dip step, as the molten solder powder is self-collected between the connecting terminal (11) of the circuit board (21) and the electrode terminal (12) of the semiconductor chip (20), a connecting body (22) is formed between the terminals. Then, the semiconductor chip (20) and the circuit board (21) are taken out from the dip bath (40), the molten resin (14) infiltrated in the space between the semiconductor chip (20) and the circuit board (21) is hardened, and a flip chip mounting body is completed.