Printed circuit board for use in mobile phone, has conductor path structure including test points made of copper, in which test points requiring high-order contacting safety are coated with hard gold and other points are coated with carbon

摘要

The board has a conductor path structure with test points made of copper, where the points test the structure and high frequency or battery voltage switching components/devices provided on a surface of the board. The test points requiring high-order contacting safety are coated with hard gold and the other test points are coated with carbon. An organically passivated copper protective layer is provided directly on selected test points.