<p>A laser diode assembly has a laser diode (12) having an emitting surface (20) and a reflective surface (22) opposing the emitting surface. A first electrically conductive heat sink (16) is attached to one surface of the laser diode via a first solder bond (19) and has a first cooling channel (40). A second electrically conductive heat sink (14) is attached to another surface of the laser diode via a second solder bond (18) and has a second cooling channel. A top side of a substrate (30) is in communication with bottom sides of the first and second electrically conductive heat sinks. The substrate (30) is electrically insulating and has a flow channel system (45) for passing a coolant (53) to the first cooling channel and the second cooling channel (40). A metallization layer (32) that is isolated from the coolant is attached to the first heat sink (16) and the second heat sink (14) and is electrically coupled to the laser diode and conducts electrical current to the laser diode.</p>
申请公布号
WO2006098897(A1)
申请公布日期
2006.09.21
申请号
WO2006US07567
申请日期
2006.03.01
申请人
NORTHROP GRUMMAN CORPORATION;STEPHENS, EDWARD, FRANKLIN, IV