发明名称 METAL CORE SUBSTRATE AND ONBOARD SYSTEM USING SAME
摘要 PROBLEM TO BE SOLVED: To provide a metal core substrate which can achieve miniaturization and thinning, dispensing with requirements for mounting a large terminal and connector in the substrate. SOLUTION: In the metal core substrate 1, an insulating layer 11 is formed on the upper surface of a metal plate used as a core, and a circuit pattern 12 is formed on the upper surface thereof. The end of a metal plate is exposed so as to be used as a terminal for external connection. Especially, a metal plate is separated into a heat dissipation plate 13 for the heat dissipation of an exothermic element 2, and terminal plates 14 and 15 for male terminals. This exothermic element 2 and an actuator 3 for driving the exothermic element 2 are mounted in different surfaces, respectively. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006253428(A) 申请公布日期 2006.09.21
申请号 JP20050068309 申请日期 2005.03.11
申请人 YAZAKI CORP 发明人 SUZUKI MASATAKA;HAYAKAWA KENJI
分类号 H05K1/05;H05K1/02 主分类号 H05K1/05
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