| 摘要 |
PROBLEM TO BE SOLVED: To provide a brazing filler metal which does not contain Pb, yields a junction unmeltable in spite of heating to 26°C, is excellent in wettability and is low in cost. SOLUTION: The brazing filler metal which contains 2 to 5mass% Ag, and 1 to 20mass% Co, and the balance Sn and inevitable impurities is provided. Further, the brazing filler metal preferably contains 0.001 to 0.5mass% P, or 0.01 to 5mass% in total one or more of Sb, Cu, Fe and Ni. The brazing filler metal is satisfactory in wettability in die bonding a semiconductor element to a lead frame and does not remelt in spite of heating up to 260°C which is the heating temperature in the case of packaging the assembled semiconductor device to a printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
|
