Ball grid array type semiconductor component, has cooling unit from made of e.g. copper and including two sections, where one section is partially arranged between chip and substrate, and other section partially runs on housing surface

摘要

The component has a semiconductor chip arranged on a substrate, and a housing completely surrounding the chip and partially surrounding the substrate. A cooling unit (2) has two sections (14, 15), of which the section (14) is partially arranged between the chip and the substrate, and the section (15) partially runs on a surface of the housing, where the unit (2) is made from thermally conducting material .g. copper.