发明名称 |
Semiconductor device |
摘要 |
There is provided a semiconductor device composed of lead frame (13) in which the possibility of a complicated manufacturing process is prevented and a reduction in manufacturing cost can be satisfactorily achieved. <??>In such a semiconductor device, a lead frame (13) is adhered to a base substrate (15) for heat dissipation via an insulating layer (18) and an outward guided terminal portion (17) is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame, a portion (130) having a recess formed thereon is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this portion (130) formed with recess thereon when the lead frame is adhered to the base substrate via the insulating layer (18) before the bending of the lead frame. <IMAGE> |
申请公布号 |
EP1174921(B1) |
申请公布日期 |
2006.09.20 |
申请号 |
EP20010305966 |
申请日期 |
2001.07.11 |
申请人 |
HITACHI, LTD. |
发明人 |
SASAKI, YASUSHI;TANI, SHOGO;UCHINO, YOSHIHIRO;TOMIYAMA, KIYOTAKA;MAENO, YUTAKA |
分类号 |
H01L23/495;H01L23/498;H01L23/50;H01L25/07;H01L25/16;H01L25/18 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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