Printed wiring board and method for manufacturing the same

摘要

A method of manufacturing a printed wiring board, the method comprising the steps of:
preparing an insulating layer including a copper foil bonded on the surface of the insulating layer;
irradiating a laser beam on the insulating layer to define interconnecting through holes;
covering the copper foil and the walls of the interconnecting trough holes with metal plating films;
covering the opening of the interconnecting trough hole with the covering pad;
covering the surface of the insulating substrate with a solder resist so that the covering pad is exposed; and
fusing solder balls and bonding them on the covering pad.