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发明名称
WAFER PLATING CUP
摘要
申请公布号
KR20060099877(A)
申请公布日期
2006.09.20
申请号
KR20050021393
申请日期
2005.03.15
申请人
HYNIX SEMICONDUCTOR INC.
发明人
KIM, SUNG MIN
分类号
H01L21/288
主分类号
H01L21/288
代理机构
代理人
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