TESTING APPARATUS OF BGA PACKAGE SOLDER BALL,申请号KR20050021169-传众专利搜索

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发明名称	TESTING APPARATUS OF BGA PACKAGE SOLDER BALL
摘要
申请公布号	KR20060099749(A)	申请公布日期	2006.09.20
申请号	KR20050021169	申请日期	2005.03.14
申请人	LG ELECTRONICS INC.	发明人	KIM, JAE CHAN
分类号	H01L21/66	主分类号	H01L21/66
代理机构		代理人
主权项
地址

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