| 摘要 |
PURPOSE: A stack package is provided to enable mass-production and reduce fabricating cost by facilitating fabricating process while minimizing the stack height of a stack package. CONSTITUTION: A flexible substrate(32) electrically connects the signals of the packages and is made of a pliable material along the sidewall of the lower package of the packages, positioned between stacked packages(30). A support substrate(34) comes in contact with the flexible substrate. Solder balls(35a,35b) for electrically connecting a signal and transferring the signal to the outside are melted and attached to the lower part of the support substrate. The support substrate is made of a hard material that is positioned in the lowermost part of the stacked packages to support the package. |
