发明名称 |
Electronic assembly with integral thermal transient suppression |
摘要 |
An electronic assembly (100) with integral thermal transient suppression includes an integrated circuit (IC) chip (106) disposed within a cavity (103) of an IC device package (102). A transient thermal suppression material (TTSM) (110) is disposed in the cavity (103) in thermal contact with the IC chip (106). A heat sink (112) may also be provided in thermal contact with the chip (106). When present, the heat sink (112) serves as a cover of the packaged IC chip (106) and may include fins (112A,112B) extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM (110)).The TTSM (110) may be thought of as a phase change material that absorbs energy dissipated by the IC chip (106) in a phase change event. |
申请公布号 |
EP1703557(A2) |
申请公布日期 |
2006.09.20 |
申请号 |
EP20060075528 |
申请日期 |
2006.03.07 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
CHENGALVA, SURESH K.;MYERS, BRUCE A.;WALSH, MATTHEW R. |
分类号 |
H01L23/427;H01L23/31;H01L23/367;H01L23/373 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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