| 摘要 |
A metal polishing solution comprising an oxidizing agent, wherein assuming that an oxidation reaction rate immediately after an oxidation of a metal to be polished starts at its surface is E1 and an oxidation reaction rate when an oxidation reaction reaches a stationary state is E2, E1/E2 is 1.5 or more and a time required for reaching an oxidation reaction rate of (E1+E2)/2 is from 1 to 50 seconds.
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