SUBSTRATE DIVIDING APPARATUS AND METHOD FOR DIVIDING SUBSTRATE

摘要

A substrate cutting apparatus for cutting a substrate includes a scribe line forming means for forming a scribe line on a substrate and a breaking means for breaking the substrate along the scribe line. The breaking means includes means for spraying a heated fluid having a temperature sufficient to cause expansion of the substrate onto the scribe line formed on the substrate so as to further extend a vertical crack extending from the scribe line in the thickness direction of the substrate.