发明名称 Wiring board with bending section
摘要 A wiring substrate to be used in a variety of electronic apparatuses, and an input device, such as an optically transparent touch panel, using the same wiring substrate, and a method of manufacturing the same input device are disclosed. The invention simplifies a construction of the wiring substrate, reduces the number of manufacturing steps of the substrate, and makes all the connectors of the substrate in a single-sheet structure. The electrical and mechanical connections of those connectors to other connecting means can be thus highly reliable. Plural wiring patterns 22, 23, 24 and 25 , and connectors 22 A, 23 A, 24 A and 25 A are formed on a first principal surface of wiring substrate 20 . Substrate 20 includes flexible bending section P-P, and when substrate 20 is bend along bending section P-P, some connectors such as 24 A, 25 A are placed on a second principal surface opposite to the first one, so that wiring substrate 20 is formed.
申请公布号 US7108515(B2) 申请公布日期 2006.09.19
申请号 US20050039876 申请日期 2005.01.24
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TANABE KOJI;FUJII SHOJI;CHIKAHISA YOSUKE
分类号 H01R12/00;H01H13/70;H01H13/702;H01R11/30;H05K1/11 主分类号 H01R12/00
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