发明名称 Parallel Capacitor in a semiconductor device
摘要 <p>Disclosed herein is a parallel capacitor of a semiconductor device. According to the present invention, a first capacitor and a second capacitor are formed in different layers of the same region, wherein a metal layer connected to an upper electrode of the first capacitor is formed in the same layer as a metal layer connected to a lower electrode of the second capacitor. Thus, two capacitors can be connected in parallel only with a metal layer composed of three layers. Accordingly, the present invention is advantageous in that it can reduce process steps for forming multiple metal layers, lower a step and cut manufacture cost.</p>
申请公布号 KR100624906(B1) 申请公布日期 2006.09.19
申请号 KR20040048237 申请日期 2004.06.25
申请人 发明人
分类号 H01L27/04;H01L21/02;H01L23/522;H01L27/06;H01L31/062 主分类号 H01L27/04
代理机构 代理人
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