Sealing apparatus for semiconductor wafer and method of manufacturing semiconductor device by using sealing apparatus

摘要

A sealing apparatus for a semiconductor wafer includes an upper mold and a lower mold. The lower mold includes a recess in which the semiconductor wader is placed, and a pot for introducing resin to the recess. The pot is located under a center area of the recess. Thus, when the resin is introduced in the recess, the resin is spread from the center area of the semiconductor wafer toward the peripheral area.