| 发明名称 |
System for reducing or eliminating semiconductor device wire sweep |
| 摘要 |
Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.
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| 申请公布号 |
US7109586(B2) |
申请公布日期 |
2006.09.19 |
| 申请号 |
US20050146366 |
申请日期 |
2005.06.06 |
| 申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
BATISH RAKESH;HMIEL ANDREW F.;SANDGREN GLENN;VONSEGGERN WALT;KULICKE C. SCOTT |
| 分类号 |
H01L29/40;H01L21/44;H01L21/4763;H01L21/48;H01L21/50;H01L21/56;H01L21/603;H01L21/607;H01L23/49;H01L23/495 |
主分类号 |
H01L29/40 |
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