| 摘要 |
A transporting tool of this invention transports a cracked wafer between an unload table and a test position through fork, having a vacuum suction mechanism, and a main chuck. The transporting tool of this invention has a first groove formed in a first surface of the transporting tool, a first through hole which is formed to correspond to a first opening of the fork and is open to the first groove, a second groove formed in a second surface to correspond to an attracting groove of the main chuck, and a second through hole which allows the first groove and second groove to communicate with each other.
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