发明名称 Method and device for polishing
摘要 The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.
申请公布号 US7108579(B2) 申请公布日期 2006.09.19
申请号 US20040485273 申请日期 2004.01.30
申请人 EBARA CORPORATION 发明人 WADA YUTAKA;AKATSUKA TOMOHIKO;SASAKI TATSUYA
分类号 B24B1/00;B24B7/22;B24B37/04;B24B49/12;B24B53/007;B24B53/02;C09G1/00;H01L21/304;H01L21/3105 主分类号 B24B1/00
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