发明名称 Method of recycling printed circuit board
摘要 The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4 a and resin-metal separation equipment 51 are used in hot filtration process P 400 . The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1 a pass through the filter. Then, the insulating material 1 a and the metallic material 1 b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.
申请公布号 US7107661(B2) 申请公布日期 2006.09.19
申请号 US20030381054 申请日期 2003.03.26
申请人 DENSO CORPORATION 发明人 KAMIMURA RIKIYA;NAKAMURA KATSUMI;KOND KOUJI;SAKAIDA ATSUSI;TANIGUCHI TOSHIHISA
分类号 B23P19/04;B02C17/00;B09B5/00;B29B17/02;C22B7/00;H05K3/22;H05K3/40;H05K3/46 主分类号 B23P19/04
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