| 摘要 |
A novel polysiloxane having high transparency to radiations with a wavelength of 193 nm or less, particularly 157 nm or less, and exhibiting superior dry etching resistance and a radiation-sensitive resin composition comprising the polysiloxane exhibiting superior sensitivity, resolution, and the like are provided. The polysiloxane is a resin having the structural unit (I) and/or structural unit (II) of the following formula (1), and having an acid-dissociable group, wherein R<SUP>1 </SUP>represents a monovalent aromatic group substituted with a fluorine atom or a fluoroalkyl group or a monovalent aliphatic group substituted with a fluorine atom or a fluoroalkyl group and R<SUP>2 </SUP>represents the above a monovalent aromatic group, the above monovalent aliphatic group, a hydrogen atom, a monovalent hydrocarbon group, haloalkyl group, or amino group. The radiation-sensitive resin composition (A) comprises the polysiloxane (A) and the photoacid generator (B)
|
