| 摘要 |
Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance. |
