发明名称 |
Method for manufacturing a chip carrier |
摘要 |
A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of island-defining portions is arranged about each of the receiving zones. Rigidity-reducing arrangements are created between neighboring island-defining portions by removing material from the substrate.
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申请公布号 |
US7107674(B2) |
申请公布日期 |
2006.09.19 |
申请号 |
US20040893379 |
申请日期 |
2004.07.19 |
申请人 |
SILVERBROOK RESEARCH PTY LTD |
发明人 |
SILVERBROOK KIA |
分类号 |
H01L23/12;H01R9/00;H01L21/48;H01L23/13;H01L23/14;H01L23/498;H05K1/02;H05K3/34 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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