Structure of metal wiring in semiconductor device and method of forming the same,申请号KR20030100164-传众专利搜索

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发明名称	Structure of metal wiring in semiconductor device and method of forming the same
摘要
申请公布号	KR100622637(B1)	申请公布日期	2006.09.18
申请号	KR20030100164	申请日期	2003.12.30
申请人		发明人
分类号	H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
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