发明名称 |
METHOD FOR PROVIDING DOUBLE-SIDED COOLING OF LEADFRAME-BASED WIRE-BONDED ELECTRONIC PACKAGES AND DEVICE PRODUCED THEREBY |
摘要 |
A method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages. The method includes the steps of: positioning a plurality of heatslug members (140) over a corresponding plurality of electronic packages (100') formed on a leadframe strip (142), wherein each of the heatslug members includes a heatslug (130) and a plurality of legs (144) for supporting the heatslug over a respective one of the electronic packages; introducing a molding compound (132) between each heatslug member and its respective electronic package; curing the molding compound; and cutting the heatslug members and separating the electronic packages (100) from the leadframe strip, such that each electronic package includes a heatslug for cooling a first side of the electronic package. |
申请公布号 |
KR20060098371(A) |
申请公布日期 |
2006.09.18 |
申请号 |
KR20067007544 |
申请日期 |
2006.04.19 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
FAN XUEJUN |
分类号 |
H01L23/34;H01L21/56;H01L23/31;H01L23/433;H01L23/495 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|