| 摘要 |
An acceleration sensor including a sensor chip for converting into an electrical signal an acceleration applied in a direction of a sensitive axis parallel to a board face of a printed circuit board, which has a first wire bonding face, a wiring base for supporting the sensor chip, which includes second and third wire bonding faces and a wiring pattern formed on the second and third wire bonding faces and a package for accommodating the wiring base having the sensor chip mounted thereon, which has a mounting face to be mounted on the board face of the printed circuit board and a fourth wire bonding face substantially parallel to the mounting face such that the wiring pattern on the third and second wire bonding faces of the wiring base can be connected to pads of the package and pads of the sensor chip, respectively.
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