VERFAHREN ZUM VERBINDEN UND ZUR HERSTELLUNG VON MIKROSTRUKTURBAUTEILEN GEEIGNETEN, MIKROSTRUKTURIERTEN BAUTEILLAGEN SOWIE MIKROSTRUKTURBAUTEIL

摘要

Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering under the action of heat. An Independent claim is also included for a microstructured component comprising a stack of microstructured component layers having a barrier layer and solder layer between them.