| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation conduit structure for cooling a device such as a semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure comprises a hollow blocked tube 31, and a column 314 wherein the hollow blocked tube consists of a molding of mixture material of metal and carbon of diamond structure, or a molding obtained by coating that molding or a metal molding with carbon of diamond structure. The hollow blocked tube has a heat source end 14 touching a device heat source on one end side, and a heat dissipation end touching a low temperature heat sink on the other end side. The column has one end connected with the heat source end 14 of the hollow blocked tube, and a second end touching the heat dissipation end of the hollow blocked tube. A capillary texture structure having capillary action is formed on the inner wall face of the hollow blocked tube and the surface of the column, the blocked tube is filled with cooling fluid, the fluid is vaporized by heat conduction and evaporated. The vaporized fluid is condensed at the low temperature heat dissipation end and returned through capillary action of the capillary texture structure. COPYRIGHT: (C)2006,JPO&NCIPI |
