发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition remarkably excellent in padding property by screen printing method using metal mask or screen mesh mask and being extremely slight in occurrence of voids and hollows. SOLUTION: The thermosetting resin composition is used for filling holes (a) by screen printing method using a metal mask or screen mesh mask having opening diameters larger than inner diameters of the holes (a) and has 1.1-3.0 tanδin 1-10 Hz frequency at 23°C. It is preferable that inner diameters of the holes (a) are 100-400μm and interval between holes (a) is 1,3-2.0 times larger than inside diameters of the holes (a) in the thermosetting resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006241449(A) 申请公布日期 2006.09.14
申请号 JP20060027936 申请日期 2006.02.06
申请人 SAN NOPCO LTD 发明人 KOUDA KAZUHIKO;KIMURA YASUO
分类号 C08L63/00;C08K9/04 主分类号 C08L63/00
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