| 摘要 |
A method of producing a flexible circuit according to an embodiment herein include supplying a substrate layer film and supplying a cover layer film. A conductive ink is printed on at least a portion of the substrate layer film using an ink jet printing technique. The cover layer film is then laminated over the substrate layer film to provide the flexible circuit. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
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