| 摘要 |
Disclosed is a semiconductor device including an organic material substrate, a semiconductor chip flip chip connected to substantially a center of one surface of the organic material substrate, and a semiconductor package mounted on another surface of the organic material substrate in a manner to avoid a position opposing to the flip chip connected semiconductor chip. Additionally, disclosed is a semiconductor device including an organic material substrate, a semiconductor chip flip chip connected to substantially a center of one surface of the organic material substrate, and a semiconductor package having a connection terminal and mounted on another surface of the organic material substrate via the connection terminal in a manner that an overlap with the flip chip connected semiconductor chip occurs, at least a part of the connection terminal in the overlap being a dummy terminal not used for transmission of an electric signal.
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