RESIN SUBSTRATE, SUBSTRATE FOR ELECTRONIC COMPONENT HAVING ELECTROLESS PLATING APPLIED THEREON, AND PROCESS FOR PRODUCTION OF SUBSTRATE FOR ELECTRONIC COMPONENT

摘要

Disclosed is a technique which is applicable to a resin substrate typically used as a substrate and can improve the adherability between the substrate and a metal-plated layer, that is, a resin substrate for general use which has an improved adherability against a metal-plated layer. A resin substrate comprising, for example, an epoxy resin, prepared by treating its surface which has swellability with a solution containing imidazolesilane and a compound of a noble metal (e.g., palladium) which has a catalytic effect on electroless plating. A substrate for an electronic component, comprising the resin substrate having electroless plating applied thereon.