| 摘要 |
A lead frame comprises leads (100) formed on four sides of the lead frame; and tie bars (200) which extend from the edges of each of the four sides and have bottom surfaces recessed. Independent claims are also included for the following: (1) a semiconductor chip package comprising a lead frame; a semiconductor chip which is adhered to the recessed surfaces of the tie bars; connectors which electrically connect chip pads formed on an upper surface of the semiconductor chip with the leads of the lead frame; and an encapsulant which encapsulates the upper surface of the semiconductor chip, the connectors and bonding portions of the connectors; and (2) a method of manufacturing a semiconductor chip package comprising providing a lead frame having leads and tie bars in which bottom surfaces of the tie bars are recessed; adhering a semiconductor chip to the recessed surfaces of the tie bars so that an active surface of the semiconductor chip faces upward; electrically connecting chip pads formed on the active surface of the semiconductor chip with the leads; and encapsulating an upper surface of the semiconductor chip, an upper surface of the lead frame, the connectors and bonding portions of the connectors to expose lower surfaces of the leads and a lower surface of the semiconductor chip. |
