发明名称 |
MACHINING METHOD USING LASER ABLATION, AND MATERIAL MACHINED BY THE MACHINING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for efficiently performing a high precision machining using a laser ablation. <P>SOLUTION: In the machining method of a material by means of the laser ablation using a pulse laser beam, an ablation threshold with a unit of J/cm<SP>2</SP>is plotted as a function of a laser pulse width with a unit of p second, in the logarithmic graph showing the relation thereof, the method is characterized in that a material having a nearly linear region with a gradient less than 0.5 is machined by a pulse laser beam with a laser pulse width within that region. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006239730(A) |
申请公布日期 |
2006.09.14 |
申请号 |
JP20050058180 |
申请日期 |
2005.03.02 |
申请人 |
SUMITOMO ELECTRIC IND LTD;KYOTO UNIV |
发明人 |
MISHIMA HIDEHIKO;MASUDA YASUHITO;OKUDA YASUHIRO;WATAYA KENICHI;SAKABE SHUJI;HASHIDA MASAKI;SHIMIZU SEIJI |
分类号 |
B23K26/36 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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