发明名称 HIGH FREQUENCY CIRCUIT BOARD AND MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high frequency circuit board wherein reduction in a radiation gain of a high frequency signal emitted from a radiation element can be suppressed to provide a higher radiation gain. SOLUTION: The high frequency circuit board comprises a high frequency line board 11 formed thereon with a signal line 12; a power distribution line board 7 laminated on the board 11 via a first ground conductor 5b, and formed with a power distribution line 6 including a T-branch; a radiation element board 3 laminated on the board 7 via a second ground conductor 5a, and formed with a radiation element 2; a first transmission section 4b for electromagnetically connecting the signal line 12 to the power distribution line 6; and a second transmitter 4a for electromagnetically connecting the radiation element 2 to the power distribution line 6. A plurality of connection conductors 10 arranged in parallel with second and third line conductors 9a, 9b are formed to an opposite side to a first line conductor 8, while sandwiching the second and third line conductors 9a, 9b in a way of electrically interconnecting the first and second ground conductors 5b, 5a. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006245456(A) 申请公布日期 2006.09.14
申请号 JP20050061932 申请日期 2005.03.07
申请人 KYOCERA CORP 发明人 TABUCHI TOMOYA
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址