发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a channel in the sidewall of a semiconductor layer, while suppressing damages to the channel region. SOLUTION: A second semiconductor layer 5 is deposited, by selective epitaxial growth on a first semiconductor layer 3 patterned to expose the side face, surface of the second semiconductor layer 5 is thermally oxidized to form a gate insulation film 6 on the surface of the second semiconductor layer 5, and then a gate electrode 7, arranged so as to extend astride over the second semiconductor layer 5 via the sidewall thereof is formed on an insulating layer 2, thus providing a channel in the sidewall of the second semiconductor layer 5. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006245038(A) 申请公布日期 2006.09.14
申请号 JP20050054611 申请日期 2005.02.28
申请人 SEIKO EPSON CORP 发明人 KATO JURI
分类号 H01L29/786;H01L21/336 主分类号 H01L29/786
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