| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of an application film which has good flatness in the wafer surface by suppressing the deposition of a solute component within a chamber and to provide a baking apparatus and a forming apparatus of the application film. SOLUTION: A method of forming a predetermined polyimide film on a wafer W wherein a polyimide is applied by heating the wafer W evaporating a solvent component in the polyimide is constituted such that the wafer W applied by the polyimide is put into the chamber 57 of the baking apparatus 50, the surface where the polyimide of the wafer W is applied is opposed to a top plate 55 in the chamber 57, and the wafer W is heated in the state where the inside of the chamber 57 is exhausted. In this heating step, an exhaust pressure in the chamber 57 and a clearance between the top plate 55 and the wafer W are respectively selected based on the coating quantity of the polyimide applied on the wafer W and its type. COPYRIGHT: (C)2006,JPO&NCIPI
|
