| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink heat dissipation conduit structure for cooling semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure 31 is a hollow blocked tube arrangement in tight contact with a semiconductor chip at the heat source end 14 and being conducted with heat generated therefrom. The heat dissipation conduit structure 31 has a heat exchange surface 314 provided with fine irregularities on the inner wall surface and filled with cooling medium. In the heat dissipation conduit, surface of a metal molding is coated with carbon having a diamond structure or composed of a heat conduction material, i.e. a mixture material of a metal and fine carbon powder having a diamond structure. Carbon of a diamond structure has high thermal conductivity characteristics and can enhance heat conduction effect of the heat conduction material. Coating method of carbon having a diamond structure includes chemical vapor deposition, physical vapor deposition such as ion sputtering, electrodeposition, and other well known methods. COPYRIGHT: (C)2006,JPO&NCIPI |
