COVER TAPE FOR PACKAGING ELECTRONIC PARTS AND METHOD FOR PREPARING THE COVER TAPE
摘要
<p>Disclosed are a cover tape for packaging electronic parts comprising heat-seal layer formed by gravure-coating and a method for preparing the cover tape. The cover tape according to the present invention is excellent in heat-seal property, peel-off strength, anti-blocking property, haze, etc. and to this end also in work efficiency.</p>
申请公布号
WO2006095955(A1)
申请公布日期
2006.09.14
申请号
WO2005KR04360
申请日期
2005.12.16
申请人
YOUL CHON CHEMICAL CO., LTD.;HAN, HEE-SIK;KIM, YOUNG-HEE;KIM, HEON-MOO;MIN, SUNG-KI;PARK, KWAN YOUNG
发明人
HAN, HEE-SIK;KIM, YOUNG-HEE;KIM, HEON-MOO;MIN, SUNG-KI;PARK, KWAN YOUNG
